SPIN CART Thermal Compound Paste
SKU: SPIN-30G-TCP
SPIN CART Thermal Compound Paste
₹399.00
In stock
SPIN CART Thermal Compound Paste improves heat transfer efficiency between CPUs, chipsets, and heat sinks for stable cooling performance. Features non-conductive grey thermal compound formula with easy application for desktops, laptops, and electronic components.
Only 5 currently available.
About item
- SKU:
- SPIN-30G-TCP
- Weight:
- 0.3 kg
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| Specification | Value |
|---|---|
| Product Type | Thermal Compound Paste |
| Brand | SPIN CART |
| Model | Thermal Compound Paste |
| SKU | SPIN-30G-TCP |
| Compound Type | Silicone-Based Thermal Compound |
| Color | Grey |
| Paste Quantity | 30 g |
| Formula Type | Non-Conductive |
| Texture | Smooth Consistency |
| Application Type | CPU Thermal Interface |
| Chipset Compatibility | Yes |
| Heat Sink Support | Yes |
| GPU Compatibility | Yes |
| Laptop Compatibility | Yes |
| Heat Transfer Support | Improved Thermal Dissipation |
| Cooling Compatibility | Air Coolers & Heat Sinks |
| Application Method | Manual Application |
| Spreadability | Easy to Spread |
| Installation Type | User-Friendly Application |
| Operating Stability | Stable Thermal Performance |
| Dry-Out Resistance | Good Durability |
| Leakage Resistance | Low Bleed Formula |
| Usage Type | Desktop & Laptop Systems |
| Maintenance Support | Easy Reapplication |
| Electrical Safety | Electrically Safe Formula |
| Packaging Type | Syringe Tube |
| Performance Level | Standard Cooling Performance |
| Recommended Use | CPU & Chipset Cooling |
| Weight | 30 g |
| Warranty | No Manufacturer Warranty |